Recently, our company was granted an invention patent by the Japanese Patent Office, with the Chinese name of "A Processing Method for Making Nickel Gold Deposition at the Bottom of PCB Step Grooves" (Japanese Application No. 2022-510819, Japanese Patent No. 7256927, special permission).
This invention patent technology solves the problem that existing technologies can achieve the shape of step grooves, but cannot achieve chemical nickel gold on the PAD at the bottom of PCB step grooves. The finished product obtained by using this patented technology has undergone various reliability tests such as thermal shock test, high temperature test, low temperature test, high temperature & humidity test, and mechanical vibration test without any abnormalities. The patented technology not only controls the depth of the step groove accurately, but also avoids the problem of residual adhesive at the bottom of the step groove. At the same time, it also meets the demand for chemical nickel gold for PAD at the bottom of the PCB step groove. The use of the technical steps of the invention for processing does not require particularly high standards of equipment, but suitable for the existing conditions of general factories. Mass production can be achieved without the need to add other equipment, which has the advantages of low cost and high precision.
This invention patent is the first international invention patent granted by our company in Japan through the PCT (Patent Cooperation Treaty) channel, marking the first and important step in the company's overseas layout of intellectual property.
Next, our technology department will continue to focus on cultivating, exploring, and laying out high-value patents in the fields of new energy, new communication, and other technologies field, promoting the integration of intellectual property application and protection work into the entire R&D chain, and making greater contributions to the company's continuous improvement of independent innovation capabilities and core competitiveness.
